发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Lead frame Hillock-Induced Silicon Crack

[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Lead frame Hillock-Induced Silicon Crack

Flores, R.C.; Fabia, M.G.; Nabong, M.T.; Soria, A.O.; Gabunas, C.B.
  • 作者Flores, R.C.; Fabia, M.G.; Nabong, M.T.; Soria, A.O.; Gabunas, C.B.
  • 文件大小2974.89KB
  • 发表时间2006
  • DOI10.1109/ipfa.2006.251040
  • 页码248-251
← 返回【学霸图书馆】主页