[NanoScience and Technology] Applied Scanning Probe Methods III ||
- 作者Bhushan, Bharat; Fuchs, Harald
- 文件大小9724.23KB
- 发表时间2006
- DOI10.1007/b138285
ErratumMercado, L.L.; Wieser, H.; Hauck, T. · IEEE Transactions on Advanced Packaging · 2003
Modeling and Analyzing Vertical InterconnectionsMantysalo, M.; Ristolainen, E.O. · IEEE Transactions on Advanced Packaging · 2006
Intelligent SOP ManufacturingMay, G.S. · IEEE Transactions on Advanced Packaging · 2004
Multichip module photovoltaic miniarraysOrtego, P.R.; Bermejo, S.; Castaner, L.M. · IEEE Transactions on Advanced Packaging · 2001
ForewordRahal-Arabi, T. · IEEE Transactions on Advanced Packaging · 2005
Reaction analysis in stripline circuitsKabir, S.; Dvorak, S.L.; Prince, J.L. · IEEE Transactions on Advanced Packaging · 2001
Optoelectronic/VLSIGoossen, K.W. · IEEE Transactions on Advanced Packaging · 1999
Foreword Three-Dimensional PackagingBauer, C.E.; Lee, S.W.R. · IEEE Transactions on Advanced Packaging · 2005