发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Effective Thermal Via and Decoupling Capacitor Insertion For 3D System-On-Package

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Effective Thermal Via and Decoupling Capacitor Insertion For 3D System-On-Package

Wong, E.; Minz, J.; Sung Kyu Lim,

作者Wong, E.; Minz, J.; Sung Kyu Lim,
文件大小314.45KB
发表时间2006
DOI10.1109/ectc.2006.1645903
页码1795-1801

← 返回【学霸图书馆】主页