Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

• 作者K.S. Kim; J.Y. Song; E.K. Chung; J.K. Park; S.H. Hong
• 卷第38卷
• 印刷ISSN0167-6636
• 文件大小477.75KB
• 发表时间2006
• DOI10.1016/j.mechmat.2005.05.015
• 页码119-127