A study of aluminium wire failure in automotive under‐hood applications
- 期刊名称Microelectronics International
- 作者Yi, Sung; Kyoo Park, Sang; Choon Teo, Kiat
- 卷第23卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小787.46KB
- 发表时间2006-05
- DOI10.1108/13565360610659653
- 页码11-20
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