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[IEEE 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2007.04.23-2007.04.25)] 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Evaluation of S/D Resistance (RSD) and Strain Scalability by Mechanical-bending Approach

[IEEE 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2007.04.23-2007.04.25)] 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Evaluation of S/D Resistance (RSD) and Strain Scalability by Mechanical-bending Approach

Wu, Kehuey; Chang, Chih-Sheng; Lin, Hong-Nien; Lee, Wen-Chin
  • 作者Wu, Kehuey; Chang, Chih-Sheng; Lin, Hong-Nien; Lee, Wen-Chin
  • 文件大小2424.60KB
  • 发表时间2007
  • DOI10.1109/vtsa.2007.378920
  • 页码1-2
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