[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green Substrates
Maw, Hla Phone; Wai, Shi Chee; Tjeung, Ricky T.; Lu Chee Wai, ; Keng, Lok Boon; Xuechuan, Shan
- 作者Maw, Hla Phone; Wai, Shi Chee; Tjeung, Ricky T.; Lu Chee Wai, ; Keng, Lok Boon; Xuechuan, Shan
- 文件大小342.79KB
- 发表时间2007
- DOI10.1109/eptc.2007.4469715
- 页码510-513