[IEEE 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) - Hyogo, Japan (2007.1.21-2007.1.25)] 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) - A 10 μm thick poly-SiGe gyroscope processed above 0.35 μm CMOS

Scheurle, A.; Fuchs, T.; Kehr, K.; Leinenbach, C.; Kronmuller, S.; Arias, A.; Ceballos, J.; Lagos, M. A.; Mora, J. M.; Munoz, J. M.; Ragel, A.; Ramos, J.; Van Aerde, S.; Spengler, J.; Mehta, A.; Verbist, A.; Du Bois, B.; Witvrouw, A.

作者Scheurle, A.; Fuchs, T.; Kehr, K.; Leinenbach, C.; Kronmuller, S.; Arias, A.; Ceballos, J.; Lagos, M. A.; Mora, J. M.; Munoz, J. M.; Ragel, A.; Ramos, J.; Van Aerde, S.; Spengler, J.; Mehta, A.; Verbist, A.; Du Bois, B.; Witvrouw, A.
文件大小1396.33KB
发表时间2007
DOI10.1109/memsys.2007.4433007
页码39-42

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[IEEE 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) - Hyogo, Japan (2007.1.21-2007.1.25)] 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) - A 10 μm thick poly-SiGe gyroscope processed above 0.35 μm CMOS