发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Electromigration behavior of 60 nm dual damascene Cu interconnects

Electromigration behavior of 60 nm dual damascene Cu interconnects

Pyun, Jung Woo; Baek, Won-Chong; Zhang, Lijuan; Im, Jay; Ho, Paul S.; Smith, Larry; Smith, Gregory
  • 期刊名称Journal of Applied Physics
  • 作者Pyun, Jung Woo; Baek, Won-Chong; Zhang, Lijuan; Im, Jay; Ho, Paul S.; Smith, Larry; Smith, Gregory
  • 卷第102卷
  • 期第9期
  • 印刷ISSN0021-8979
  • 文件大小605.20KB
  • 发表时间2007
  • DOI10.1063/1.2805425
← 返回【学霸图书馆】主页