Application of the Hot-Plane Method to Low-Density Thermal Insulators
- 期刊名称Journal of Thermophysics and Heat Transfer
- 作者Coquard, Rémi; Baillis, Dominique
- 卷第21卷
- 期第1期
- 印刷ISSN0887-8722
- 电子ISSN1533-6808
- 文件大小788.80KB
- 发表时间2007-01
- DOI10.2514/1.21610
- 页码114-127
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