[ECS 22nd Symposium on Microelectronics Technology and Devices - Rio De Janiero, Brasil (September 3 - September 6, 2007)] ECS Transactions - Stress Analysis on Ultra Thin Ground Wafers
- 作者Teixeira, R. C.; De Munck, K.; De Moor, P.; Baert, K.; Swinnen, B.; Van Hoof, C.; Kuttel, A.
- 卷第9卷
- 文件大小851.67KB
- 发表时间2007
- DOI10.1149/1.2766880
- 页码113-121
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