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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Advanced Metallization for 3D Integration

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Advanced Metallization for 3D Integration

Beica, Rozalia; Siblerud, Paul; Sharbono, Charles; Bernt, Marvin
  • 作者Beica, Rozalia; Siblerud, Paul; Sharbono, Charles; Bernt, Marvin
  • 文件大小7971.82KB
  • 发表时间2008
  • DOI10.1109/EPTC.2008.4763436
  • 页码212-218
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