[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Highly integrated flexible electronic Circuits and Modules

• 作者Loher, Thomas; Seckel, Manuel; Pahl, Barbara; Bottcher, Lars; Ostmann, Andreas; Reichl, Herbert
• 文件大小4680.80KB
• 发表时间2008
• DOI10.1109/IMPACT.2008.4783814
• 页码86-89