发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Study on no-fillet SMT solder joint reliability based on solder joint shape CAD

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Study on no-fillet SMT solder joint reliability based on solder joint shape CAD

Wu ZhaoHua, ; Zhou DeJian, ; Huang ChunYue,

作者Wu ZhaoHua, ; Zhou DeJian, ; Huang ChunYue,
文件大小534.02KB
发表时间2008
DOI10.1109/icept.2008.4607023
页码1-7

← 返回【学霸图书馆】主页