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A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Jianfang Zhu, ; Dan Jiao,

期刊名称IEEE Transactions on Advanced Packaging
作者Jianfang Zhu, ; Dan Jiao,
卷第31卷
期第4期
印刷ISSN1521-3323
电子ISSN1557-9980
文件大小1239.02KB
发表时间2008-11
DOI10.1109/tadvp.2008.924232
页码873-881

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