发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Flip chip back end design parameters to reduce bump electromigration

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Flip chip back end design parameters to reduce bump electromigration

Karajgikar, Saket; Nagaraj, Vishal; Agonafer, Dereje; Pekin, Senol
  • 作者Karajgikar, Saket; Nagaraj, Vishal; Agonafer, Dereje; Pekin, Senol
  • 文件大小644.22KB
  • 发表时间2008
  • DOI10.1109/ectc.2008.4549994
  • 页码347-353
← 返回【学霸图书馆】主页