[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Flip chip back end design parameters to reduce bump electromigration
Karajgikar, Saket; Nagaraj, Vishal; Agonafer, Dereje; Pekin, Senol
- 作者Karajgikar, Saket; Nagaraj, Vishal; Agonafer, Dereje; Pekin, Senol
- 文件大小644.22KB
- 发表时间2008
- DOI10.1109/ectc.2008.4549994
- 页码347-353