Integration of EBDW of one entire metal layer as substitution for optical lithography in 220 nm node microcontrollers

J. Kretz; H. Roeper; C. Arndt; T. Bischoff; K.-H. Choi; G. Goldbeck; M. Gunia; C. Hohle; T. Lutz; U. Schubert; I. Schwerdtfeger; F. Thrum; M. Vennekamp

作者J. Kretz; H. Roeper; C. Arndt; T. Bischoff; K.-H. Choi; G. Goldbeck; M. Gunia; C. Hohle; T. Lutz; U. Schubert; I. Schwerdtfeger; F. Thrum; M. Vennekamp
卷第85卷
印刷ISSN0167-9317
文件大小589.32KB
发表时间2008
DOI10.1016/j.mee.2007.12.055
页码792-795

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Integration of EBDW of one entire metal layer as substitution for optical lithography in 220 nm node microcontrollers