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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

Qiulian Zeng, ; Jianjun Guo, ; Xiaolong Gu, ; Xinbing Zhao,
  • 作者Qiulian Zeng, ; Jianjun Guo, ; Xiaolong Gu, ; Xinbing Zhao,
  • 文件大小2792.87KB
  • 发表时间2008
  • DOI10.1109/icept.2008.4607093
  • 页码1-5
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