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A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Dan Jiao, ; Jianfang Zhu, ; Chakravarty, S.

期刊名称IEEE Transactions on Advanced Packaging
作者Dan Jiao, ; Jianfang Zhu, ; Chakravarty, S.
卷第31卷
期第4期
印刷ISSN1521-3323
电子ISSN1557-9980
文件大小804.10KB
发表时间2008-11
DOI10.1109/tadvp.2008.927813
页码890-899

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