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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization of dynamic behavior of Pb-free material 95.7Sn3.8Ag0.5Cu and its determination of dynamic constitutive model parameters

Liang Lihua, ; Chen Xuefan, ; Wang Qiang, ; Liu Fei, ; Yong Liu, ; Irving, Scott; Luk, Timwah
  • 作者Liang Lihua, ; Chen Xuefan, ; Wang Qiang, ; Liu Fei, ; Yong Liu, ; Irving, Scott; Luk, Timwah
  • 文件大小384.86KB
  • 发表时间2008
  • DOI10.1109/esime.2008.4525027
  • 页码1-5
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