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[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - An application of C-AFM as a tool for SRAM soft single-column failure analysis in advanced HV technologies

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - An application of C-AFM as a tool for SRAM soft single-column failure analysis in advanced HV technologies

Hung-Sung Lin, ; Mong-Sheng Wu, ; Yun-Ming Tsou,
  • 作者Hung-Sung Lin, ; Mong-Sheng Wu, ; Yun-Ming Tsou,
  • 文件大小353.20KB
  • 发表时间2008
  • DOI10.1109/ipfa.2008.4588161
  • 页码1-4
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