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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Progress, Opportunities and Challenges in Modeling of Plasma Etching

[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Progress, Opportunities and Challenges in Modeling of Plasma Etching

Yang, Yang; Wang, Mingmei; Kushner, Mark J.

作者Yang, Yang; Wang, Mingmei; Kushner, Mark J.
文件大小567.49KB
发表时间2008
DOI10.1109/iitc.2008.4546934
页码90-92

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