Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite

L. Li; S.M. Kim; S.H. Song; T.W. Ku; W.J. Song; J. Kim; M.K. Chong; J.W. Park; B.S. Kang

作者L. Li; S.M. Kim; S.H. Song; T.W. Ku; W.J. Song; J. Kim; M.K. Chong; J.W. Park; B.S. Kang
卷第201卷
印刷ISSN0924-0136
文件大小424.17KB
发表时间2008
DOI10.1016/j.jmatprotec.2007.11.190
页码746-750

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