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Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Lee, Seong Hee; Kim, Sang Shik; Han, Seung Zeon; Lim, Cha Yong

期刊名称Materials Science Forum
作者Lee, Seong Hee; Kim, Sang Shik; Han, Seung Zeon; Lim, Cha Yong
电子ISSN1662-9752
文件大小3996.42KB
发表时间2008
DOI10.4028/www.scientific.net/MSF.580-582.71
页码71-74

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