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SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - <title>Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps</title>

SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps

Carazzetti, P.; Renaud, Ph.; Shea, H. R.; Hartzell, Allyson L.; Ramesham, Rajeshuni
  • 作者Carazzetti, P.; Renaud, Ph.; Shea, H. R.; Hartzell, Allyson L.; Ramesham, Rajeshuni
  • 卷第6884卷
  • 印刷ISSN0277-786X
  • 文件大小789.59KB
  • 发表时间2008
  • DOI10.1117/12.763195
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