[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Lumped models for Vias in multilayered PCBs
Heinrich, Gerd; Dickmann, Stefan
- 作者Heinrich, Gerd; Dickmann, Stefan
- 文件大小182.73KB
- 发表时间2009
- DOI10.1109/ISEMC.2009.5284700
- 页码33-38