[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - A novel on-chip fractal power tree network based on leaf vein grids

• 作者HuiFen Huang, ; QingXin Chu, ; JianKang Xiao,
• 文件大小6233.76KB
• 发表时间2009
• DOI10.1109/edaps.2009.5403999
• 页码1-4