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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints

Peng, Jin; Wu, Fengshun; Liu, Hui; Zhou, Longzao; Pan, Qilin

作者Peng, Jin; Wu, Fengshun; Liu, Hui; Zhou, Longzao; Pan, Qilin
文件大小1614.01KB
发表时间2009
DOI10.1109/icept.2009.5270577
页码1023-1026

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