[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Several modeling issues in LED, 3D-SiP, and nano interconnects
Liu, Sheng; Wang, Kai; Gan, Zhiyin; Luo, Xiaobing; Xiaohui Song, ; Chen, Zhaohui; Liu, Zongyuan; Han Yan, ; Wei, Wei; Pei Wang,
- 作者Liu, Sheng; Wang, Kai; Gan, Zhiyin; Luo, Xiaobing; Xiaohui Song, ; Chen, Zhaohui; Liu, Zongyuan; Han Yan, ; Wei, Wei; Pei Wang,
- 文件大小1448.60KB
- 发表时间2009
- DOI10.1109/esime.2009.4938516
- 页码1-10