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[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Next generation I/O power delivery design through SIPD co-analysis & comprehensive platform validation

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Next generation I/O power delivery design through SIPD co-analysis & comprehensive platform validation

Tau, Yee Hung See; Chan, Marcus

作者Tau, Yee Hung See; Chan, Marcus
文件大小883.34KB
发表时间2009
DOI10.1109/epeps.2009.5338441
页码211-214

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