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Overcoming of nanoscale adhesion by electrostatic induction

Overcoming of nanoscale adhesion by electrostatic induction

Donghyun Kim; Hyun Chul Park; Kun-Hong Lee; Ki-Bae Park; Kangduk Choi; Woonbong Hwang
  • 作者Donghyun Kim; Hyun Chul Park; Kun-Hong Lee; Ki-Bae Park; Kangduk Choi; Woonbong Hwang
  • 卷第9卷
  • 期第3期
  • 印刷ISSN1567-1739
  • 文件大小1835.99KB
  • 发表时间2009
  • DOI10.1016/j.cap.2008.06.017
  • 页码703-706
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