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[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dynamic study and structure enhancement of small outline dual-in-line memory module

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dynamic study and structure enhancement of small outline dual-in-line memory module

Huang, C. J.; Chou, C. Y.; Chiang, K. N.
  • 作者Huang, C. J.; Chou, C. Y.; Chiang, K. N.
  • 文件大小9897.03KB
  • 发表时间2009
  • DOI10.1109/esime.2009.4938465
  • 页码1-5
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