[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer - Contribution of D-Band Electrons to Ballistic Electron Transport and Interfacial Scattering During Electron-Phonon Nonequilibrium in Thin Metal Films
- 作者Hopkins, Patrick E.
- 文件大小266.08KB
- 发表时间2009
- DOI10.1115/ht2009-88270
- 页码193-201
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 3 - Independent Hybrid Power Plant “PEMFC+MEMS” With Use of Molecular Ceramic Membranes to Separate CO and H2Soudarev, A. V.; Souryaninov, A. A.; Konakov, V. G.; Molchanov, A. S. · 2005
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - COZhang, Chong; Bet, Sachin; Salama, Islam A.; Quick, Nathaniel R.; Kar, Aravinda · 2005
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic SubstratesChoi, Woon; Ono, Shintaro; Yoshida, Seiichiro; Tomokage, Hajime · 2005
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Cu-Direct Via-Hole Drilling of Aramid Fiber Reinforced Build-Up Layer by COAoyama, Eiichi; Hirogaki, Toshiki; Ogawa, Keiji; Doi, Nobuyuki; Minagi, Ryu · 2005