A multi crossing wire bonding technique for high power transistor packages
Jongsik, Lim; Seongmin, Oh; Yongho, Lee; Jakyung, Koo; Yongchae, Jeong; Dal, Ahn
- 期刊名称European Microwave Week 2009, EuMW 2009: Science, Progress and Quality at Radiofrequencies, Conference Proceedings - 39th European Microwave Conference, EuMC 2009
- 作者Jongsik, Lim; Seongmin, Oh; Yongho, Lee; Jakyung, Koo; Yongchae, Jeong; Dal, Ahn
- 文件大小325.84KB
- 发表时间2009
- DOI10.1109/EUMC.2009.5296177
- 页码1353-1356