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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
  • 作者Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
  • 文件大小4574.72KB
  • 发表时间2010
  • DOI10.1109/ectc.2010.5490655
  • 页码1281-1295
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