[IEEE 2010 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2010.12.6-2010.12.8)] 2010 International Electron Devices Meeting - Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias
- 作者Murugesan, M.; Kino, H.; Nohira, H.; Bea, J.C.; Horibe, A.; Yamada, F.; Miyazaki, C.; Kobayashi, H.; Fukushima, T.; Tanaka, T.; Koyanagi, M.
- 文件大小4610.74KB
- 发表时间2010
- DOI10.1109/iedm.2010.5703279
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