[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - An MCM package process for 24GHz driver amplifier using photosensitive BCB

Jiajie Tang, ; Huajiang Wang, ; Xiao Chen, ; Wenguo Ning, ; Gaowei Xu, ; Xiaowei Sun, ; Le Luo,

作者Jiajie Tang, ; Huajiang Wang, ; Xiao Chen, ; Wenguo Ning, ; Gaowei Xu, ; Xiaowei Sun, ; Le Luo,
文件大小803.98KB
发表时间2010
DOI10.1109/icept.2010.5582382
页码19-22

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