[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Electrical stress on film resistive structures on flexible substrates
- 作者Bonfert, D.; Klink, G.; Gieser, H.; Bock, K.; Svasta, P.; Ionescu, C.
- 文件大小1976.55KB
- 发表时间2010
- DOI10.1109/estc.2010.5643017
- 页码1-6
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