[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Development of low temperature dielectrics down to 150°C for multiple TSVs structure with Wafer-on-Wafer (WOW) technology
Kitada, H.; Maeda, N.; Fujimoto, K.; Mizushima, Y.; Nakata, Y.; Nakamura, T.; Lee, W.; Kwon, Y-S.; Ohba, T.
- 作者Kitada, H.; Maeda, N.; Fujimoto, K.; Mizushima, Y.; Nakata, Y.; Nakamura, T.; Lee, W.; Kwon, Y-S.; Ohba, T.
- 文件大小798.95KB
- 发表时间2010
- DOI10.1109/iitc.2010.5510744
- 页码1-3