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[IEEE 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Beijing, China (2010.04.12-2010.04.16)] 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Novel on chip power distribution technique based on plant vein

[IEEE 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Beijing, China (2010.04.12-2010.04.16)] 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Novel on chip power distribution technique based on plant vein

HuiFen Huang, ; QingXin Chu, ; Sy, Liu; JianKang Xiao,

作者HuiFen Huang, ; QingXin Chu, ; Sy, Liu; JianKang Xiao,
文件大小1252.37KB
发表时间2010
DOI10.1109/apemc.2010.5475855
页码354-357

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