Application of metadata modeling to dispute review report management
- 期刊名称Journal of Civil Engineering and Management
- 作者Zhu, Yimin; Bayraktar, Mehmet Emre; Chen, Shu‐Ching
- 卷第16卷
- 期第4期
- 印刷ISSN1392-3730
- 电子ISSN1822-3605
- 文件大小640.57KB
- 发表时间2010-12
- DOI10.3846/jcem.2010.55
- 页码491-498
ErratumMercado, L.L.; Wieser, H.; Hauck, T. · IEEE Transactions on Advanced Packaging · 2003
Modeling and Analyzing Vertical InterconnectionsMantysalo, M.; Ristolainen, E.O. · IEEE Transactions on Advanced Packaging · 2006
Intelligent SOP ManufacturingMay, G.S. · IEEE Transactions on Advanced Packaging · 2004
Multichip module photovoltaic miniarraysOrtego, P.R.; Bermejo, S.; Castaner, L.M. · IEEE Transactions on Advanced Packaging · 2001
ForewordRahal-Arabi, T. · IEEE Transactions on Advanced Packaging · 2005
Reaction analysis in stripline circuitsKabir, S.; Dvorak, S.L.; Prince, J.L. · IEEE Transactions on Advanced Packaging · 2001
Optoelectronic/VLSIGoossen, K.W. · IEEE Transactions on Advanced Packaging · 1999
Foreword Three-Dimensional PackagingBauer, C.E.; Lee, S.W.R. · IEEE Transactions on Advanced Packaging · 2005