发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Optimization of the Microwave Induced Plasma system for failure analysis in integrated circuit packaging

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Optimization of the Microwave Induced Plasma system for failure analysis in integrated circuit packaging

Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.

作者Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.
文件大小865.55KB
发表时间2010
DOI10.1109/icept.2010.5582713
页码1034-1038

← 返回【学霸图书馆】主页