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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Drop test simulation of 3D stacked-die packaging with Input-G finite element method

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Drop test simulation of 3D stacked-die packaging with Input-G finite element method

Zhaohui Chen, ; XueFang Wang, ; Liu, Yong; Sheng Liu,

作者Zhaohui Chen, ; XueFang Wang, ; Liu, Yong; Sheng Liu,
文件大小1002.61KB
发表时间2010
DOI10.1109/icept.2010.5582836
页码742-746

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