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A MEMS bubble pump for an electronic cooling device

A MEMS bubble pump for an electronic cooling device

Suh, Junwoo; Cytrynowicz, Debra; Gerner, Frank M; Henderson, H Thurman

期刊名称Journal of Micromechanics and Microengineering
作者Suh, Junwoo; Cytrynowicz, Debra; Gerner, Frank M; Henderson, H Thurman
卷第20卷
期第12期
印刷ISSN0960-1317
电子ISSN1361-6439
文件大小806.65KB
发表时间2010-12-01
DOI10.1088/0960-1317/20/12/125025

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