Tin pest in lead‐containing solders
- 期刊名称Soldering & Surface Mount Technology
- 作者Plumbridge, W.J.
- 卷第22卷
- 期第1期
- 印刷ISSN0954-0911
- 文件大小199.83KB
- 发表时间2010-02-09
- DOI10.1108/09540911011015157
- 页码56-57
[IEEE 2019 IEEE International Conference on Pervasive Computing and Communications Workshops (PerCom Workshops) - Kyoto, Japan (2019.3.11-2019.3.15)] 2019 IEEE International Conference on Pervasive Computing and Communications Workshops (PerCom Workshops) - PerCom PhD Forum 2019: PhD Forum on Pervasive Computing and Communications 2019 - Program2019
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