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[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection

Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 作者Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 文件大小2711.40KB
  • 发表时间2010
  • DOI10.1115/IMECE2010-37279
  • 页码455-461
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