Microstructure of Bonding Interface and Influence of Sn plate in Welding of Lead for Aluminum Electrolytic Condenser
- 期刊名称Journal of the Society of Materials Engineering for Resources of Japan
- 作者KUBOUCHI, Tatsuo; KAMIYA, Osamu
- 卷第23卷
- 期第1期
- 印刷ISSN0919-9853
- 电子ISSN1884-6610
- 文件大小2179.52KB
- 发表时间2010
- DOI10.5188/jsmerj.23.13
- 页码13-18
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