Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers

• 作者K. C. Huang; F. S. Shieu; T. S. Huang; C. T. Lu; C. W. Chen; H. W. Tseng; S. L. Cheng; C. Y. Liu
• 卷第39卷
• 期第11期
• 印刷ISSN0361-5235
• 电子ISSN1543-186X
• 文件大小1531.05KB
• 发表时间2010-11
• DOI10.1007/s11664-010-1346-6
• 页码2403-2411