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[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites

Pashayi, Kamyar; Fard, Hafez Raeisi; Lai, Fengyuan; Plawsky, Joel; Borca-Tasciuc, Theodorian
  • 作者Pashayi, Kamyar; Fard, Hafez Raeisi; Lai, Fengyuan; Plawsky, Joel; Borca-Tasciuc, Theodorian
  • 文件大小476.13KB
  • 发表时间2011
  • DOI10.1115/imece2011-65578
  • 页码713-714
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