[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites
Pashayi, Kamyar; Fard, Hafez Raeisi; Lai, Fengyuan; Plawsky, Joel; Borca-Tasciuc, Theodorian
- 作者Pashayi, Kamyar; Fard, Hafez Raeisi; Lai, Fengyuan; Plawsky, Joel; Borca-Tasciuc, Theodorian
- 文件大小476.13KB
- 发表时间2011
- DOI10.1115/imece2011-65578
- 页码713-714