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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Fabrication of integrated microwave passive devices using thick BCB as dielectric at wafer level

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Fabrication of integrated microwave passive devices using thick BCB as dielectric at wafer level

Tang, Jiajie; Chen, Xiao; Sun, Xiaowei; Luo, Le

作者Tang, Jiajie; Chen, Xiao; Sun, Xiaowei; Luo, Le
文件大小2767.64KB
发表时间2011
DOI10.1109/ICEPT.2011.6066792
页码1-4

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